• Code: 311G-171
• Description: HVF BM Poor Stacking RAP Use this RAP to find the cause of poor stacking in the HVF BM.
• Remedy: Check the following; • Look for sets that are not dropping back fully in the bin 1 tray and therefore not being detected by the kicker fingers and sensors: – Large paper sizes should not be stacked on top of small paper sizes. – Ensure that the paper stack in each paper tray has been fanned. – Turn over the paper stack in each paper tray. – Ensure that all paper or other copy stock being used is within the size and weight specifications. Refer to GP 20 Paper and Media Size Specifications. – Try using a fresh ream of paper. – Ensure that the edge guides of all paper trays are adjusted correctly for the paper size and that the trays are fully closed. • Labels must not be fed to bin1, but to bin 0 only. • It is recommended that transparencies are fed to bin 0 whenever possible. • Check that the bin 1 upper limit switch, S11-334 and the bin 1 lower limit switch, S11-335 are working correctly. Refer to the 311-460-00-171 to 311-462-00-171 Bin 1 Position RAP. • Make sure that the compiler carriage tampers move to the correct paper size. • Check that the HVF BM is not positioned near an air conditioning or ventilation output duct. Air flow across the output bins can cause poor stacking. • Check the output copies for curl, refer to IQ5.

• Code: 311H-120
• Description: Mis-Registration in Stapled Sets and Non- Stapled Sets RAP Use this RAP to identify and correct the causes of mis-registration in stapled sets, resulting in staples missing some sheets in the set, or poorly registered non-stapled sets.
• Remedy: The most likely cause of mis-registration is paper condition and/or damage such as curl, wrinkle, creases, dog ears, etc. Curl, wrinkle and creases are probably caused in the IOT, go to the IQ1 Image Quality Entry RAP. For other copy / print damage and dog ears, go to the 311G-120 Copy Damage in the 1K LCSS RAP. Check the following: • Check that bin 1 is seated correctly and the bin 1 alignment clip is in position, PL 11.100 Item 13. • Turn over the paper stack in the tray in use. • Use a new ream of paper in the tray in use. • Paper type, especially recycled paper, can lead to registration problems. Try changing to a different brand or type of paper. • Ensure that the guides in the paper trays are correctly set and reported on the UI for the paper size loaded. • Check that paper type is set correctly. If heavyweight paper is used but not set in the UI, the compiler capacity can be exceeded. • Check for obstructions in the compiler. • Ensure that the paddle roll operates correctly and that the paddles are not damaged. The paddles should park completely inside the top section of the compiler, with the shorter paddle in a vertical position. If all of the paddles are out of position, check the paddle roll position sensor, PL 11.104 Item 11, the flag, PL 11.104 Item 7 and the paddle motor assembly, PL 11.104 Item 10. If only one paddle is mis-aligned with the others, it can be re-positioned by hand (they are not bonded to the shaft). • Make sure the paddles are clean. If necessary, use formula A cleaning fluid, PL 26.10 Item 2 to clean the paddles. • Ensure that the tampers operate correctly, i.e. are not stalling or losing position during the job. Inspect the tampers for damage, if necessary install new parts. PL 11.112. • Inspect the bin 1 entry nips for roll damage. The idlers should be held against the rubber driving rolls and they should be free to rotate within their support springs. If necessary, install new parts, PL 11.120. • Inspect the four spring loaded guides on the output cover, PL 11.100 Item 7. Ensure that they are correctly located and are free to move up and down.

• Code: 311H-150
• Description: LVF BM Copy Damage in the LVF BM RAP Use this RAP to identify and correct the causes of copy damage in the LVF BM.
• Remedy: Check the following: • Look for torn paper in the LVF BM paper path. Torn fragments can pass through the IOT and LVF BM paper path without causing a problem until they finally wedge themselves at some point. A likely place for a piece of paper to be wedged is at the hole punch assembly, where the top and bottom guides form the narrowest part of the paper path. • Ensure that the bin 0 / bin 1 diverter assembly, PL 11.70 Item 13, operates correctly and has full movement. • Ensure that the hole punches park at the fully open position. If they protrude even slightly, a jam will occur in the narrow paper path of the hole punch. • Ensure that the paper entry guide assembly, PL 11.62 Item 7, closes and latches correctly. Check that the magnet at the rear is located and functions correctly. Check the clip at the front is positioned correctly. • Ensure that all idler rolls in the LVF BM paper path are free to rotate, particularly those on the jam clearance guide, where the paper turns through 90 degrees. • Ensure that the paper path ribs of the paper entry guide assembly, PL 11.62 Item 7, and the entry guide cover assembly, PL 11.50 Item 3, are free of “scores” and “nicks”. Check also for contamination and glue from label stock.

• Code: 311J-120
• Description: 1K LCSS Poor Stacking RAP Use this RAP to find the cause of poor stacking in the 1K LCSS.
• Remedy: Check the following; • Look for sets that are not dropping back fully in bin 1 and therefore not operating the bin 1 level sensors: – Large paper sizes should not be stacked on top of small paper sizes. – Ensure that the paper stack in each paper tray has been fanned. – Turn over the paper stack in each paper tray. – Ensure that all paper or other copy stock being used is within the size and weight specifications. Refer to GP 20 Paper and Media Size Specifications. – Try using a fresh ream of paper. – Ensure that the edge guides of all paper trays are adjusted correctly for the paper size and that the trays are fully closed. – Check that bin 1 is seated correctly and the bin 1 alignment clip is in position, PL 11.100 Item 13. • Labels must not be fed to bin 1, but to bin 0 only. • It is recommended that transparencies are fed to bin 0 whenever possible. • Check that bin 1 is level front to back, if necessary perform ADJ 11.1-120 1K LCSS Bin 1 Level. • Check that the bin 1 upper level sensor, Q11-332 is working correctly. Refer to the 311- 030-00-120 Bin 1 Movement Failure RAP. • Check the operation of the front and rear tampers. Refer to 311-005-00-120, 311-006-00- 120 Front Tamper Move Failure RAP and 311-319-00-120 Rear Tamper Move Failure RAP. • Check that the output device is not near an air conditioning or ventilation output duct. Air flow across the output bins can cause poor stacking. • Check that TAG L-013 LCSS bin 1 kit is installed on the finisher. – Machine that regularly process large stacks of A4/8.5x11 inch LEF paper should have the LCSS bin 1 W/TAG L-013 kit installed, PL 11.100 Item 10. – Machines that regular process small stacks of A4/8.5x11 inch LEF, A3/11x17 inch and A4/8.5x11 inch SEF paper should have the standard W/O TAG L-013 bin 1 installed, PL 11.100 Item 10. • Check the output copies for curl, refer to IQ5.

• Code: 311J-171
• Description: Inserter Paper Sensing and +5V Supply RAP Use this RAP to find the cause of inserter empty, inserter paper width and +5v supply problems.
• Remedy: If a +5V supply problem is suspected, perform the following: Go to 311A-171 and check the 0V and +5V supply from the HVF control PWB to the inserter control PWB. Repair the wiring as necessary, or refer to 311A-171 HVF Power Distribution RAP. Install new components as necessary: • Inserter PWB, PL 11.179 Item 9. • HVF control PWB, PL 11.157 Item 2. To diagnose inserter paper sensing and paper width problems, perform the following: Enter the dC330 code 011-153, inserter unit empty sensor, Q11-153. Use a sheet of paper to actuate Q11-153. The sensor display changes. Y↓N→Go to Flag 1 and Flag 2. Check Q11-153. Refer to: • GP 11 How to Check a Sensor. • P/J8 and P/J4, Inserter PWB. • 311A-171 HVF Power Distribution RAP Install new component as necessary: • Unit empty sensor, PL 11.175 Item 11. • Inserter PWB, PL 11.179 Item 9. • HVF control PWB, PL 11.157 Item 2. Go to Flag 3 and Flag 4. Measure the voltage from the inserter paper width sensor 1, Q11-152, while sliding paper width guide. The voltage changes. Y↓N→Check Q11-152. Refer to: • GP 11 How to Check a Sensor. • P/J8 and P/J4, Inserter PWB. • 311A-171 HVF Power Distribution RAP. Install new components as necessary: • Inserter paper width sensor 1, PL 11.175 Item 13. • Inserter PWB, PL 11.179 Item 9. • HVF control PWB, PL 11.157 Item 2. Go to Flag 5 and Flag 6. Measure the voltage from the inserter paper width sensor 2, Q11-152 while sliding paper width guide. The voltage changes. Y↓N→Check Q11-152. Refer to: • GP 11 How to Check a Sensor. • P/J8 and P/J4, Inserter PWB. • 311A-171 HVF Power Distribution RAP. Install new components as necessary: • Inserter paper width sensor 2, PL 11.175 Item 13. • Inserter PWB, PL 11.179 Item 9. • HVF control PWB, PL 11.157 Item 2. Go to Flag 7 and Flag 8. Measure the voltage from the acceleration sensor, while actuating the sensor with paper. The voltage changes. Y↓N→Check the acceleration sensor. Refer To: • GP 11 How to check a Sensor. • P/J11 and P/J4, Inserter PWB. • 311A-171 HVF Power Distribution RAP. Install new components as necessary: • Acceleration sensor, PL 11.175 Item 10. • Inserter PWB, PL 11.179 Item 9. • HVF control PWB, PL 11.157 Item 2. Got to Flag 9 and Flag 10. Measure the voltage from the IDG pickup sensor while actuating the sensor with paper. The voltage changes. Y↓N→Check the IDG Pickup sensor. Refer to: • GP 11 How to check a Sensor. • P/J7 and P/J4, Inserter PWB. • 311A-171 HVF Power Distribution RAP. Install new components as necessary: • IDG pickup sensor, PL 11.179 Item 10. • Inserter PWB, PL 11.179 Item 9. • HVF control PWB, PL 11.157 Item 2. Perform SCP 5 Final Actions.

• Code: 312-301-00
• Description: Offset Catch Tray Failure RAP 312-301 The offset catch tray has not made an index position within 450 ms of the last index position being made.
• Remedy: . Go to Flag 1 and Flag 2. Check the OCT wiring, GP 7. The wiring is good. Y↓N→Repair the wiring or install a new OCT, PL 12.10 Item 1. Enter dC330, code 012-005 to check the OCT motor, MOT12-005. MOT12-005 runs. Y↓N→Install a new OCT, PL 12.10 Item 1. Enter dC330, code 012-005 and stack code 012-301 to check the OCT index sensor, Q12- 301. The display changes as the motor runs. Y↓N→Install a new OCT, PL 12.10 Item 1. Enter dC330, code 012-300 to check the OCT tray 90% full sensor, Q12-300. Actuate the sensor. The display changes. Y↓N→Check the sensor actuator. If necessary install a new OCT, PL 12.10 Item 1. Perform SCP 5 Final Actions RAP.

• Code: 340A
• Description: Main Drive Motor and Photoreceptor Motor RAP Use this RAP to determine failures of the main drive motor and the photoreceptor motor.
• Remedy: Go to Flag 1. Check for +24V between P/J147 pin 1 and pin 2 on the Main Drive PWB. +24V is measured. Y↓N→Ensure that the drum cartridge is correctly installed and that the CRUM connector is not damaged. Check the wiring, GP 7, to the LVPS. Refer to: • 301H Short Circuit and Overload RAP. • 301B 0V Distribution RAP. Enter dC330, code 042-010 main drive motor and code 091-010 photoreceptor motor. Press Start. The main drive motor and the photoreceptor motor turn. Y↓N→If the photoreceptor motor does not turn, go to the 04A Photoreceptor Motor Checkout. If the main drive motor does not turn, go to the 04A Main Drive Motor Checkout. Check all the wiring and connections between the IOT PWB and the main drive module for damage and loose connections. 04A Photoreceptor Motor Checkout Go to Flag 3 and Flag 4. Check the wiring, GP 7. Refer to: • P/J3, IOT PWB. • P/J148, Main Drive PWB. • P/J151, Main Drive PWB. Install new components as necessary: • Main drive motor and PWB assembly (45-55 ppm), PL 40.15 Item 6. • Main drive motor and PWB assembly (65-90 ppm), PL 40.10 Item 6. • Main drive module (45-55 ppm), PL 40.15 Item 1. • Main drive module (65-90 ppm), PL 40.10 Item 1. If the fault remains, perform the OF7 IOT PWB Diagnostics RAP. 04A Main Drive Motor Checkout Go to Flag 2. Check the wiring, GP 7. Refer to: • P/J3, IOT PWB • P/J148, Main Drive PWB. Install new components as necessary: • Main drive motor and PWB assembly (45-55 ppm), PL 40.15 Item 6. • Main drive motor and PWB assembly (65-90 ppm), PL 40.10 Item 6. If the fault remains, perform the OF7 IOT PWB Diagnostics RAP.

• Code: 341-350-00, 341-351-00, 341-354-00
• Description: IOT to Tray 1 and Tray 2 PWB Error RAP 341-350-00 The IOT has detected no response from the tray 1 and 2 control PWB to the ping request. 341-351-00 Tray 1 and 2 control PWB has detected a feed buffer overflow. 341-354-00 Communications failure. Tray 1 and 2 control PWB has detected a communications failure.
• Remedy: 1. Switch off the machine, GP 14. Ensure P/J9 and P/J271 are correctly and securely connected. 2. Go to Flag 1. Check the harness. Repair as necessary, GP 7. 3. Go to Flag 2. Check the +3.3V and 0V lines. Refer to: • 301D +3.3V Distribution RAP. • 301B 0V Distribution RAP. 4. Re-load the software, GP 4 Machine Software. 5. Install a new tray 1 and 2 control PWB, PL 70.10 Item 2. 6. If the fault remains, perform the OF7 IOT PWB Diagnostics RAP.